Discover the LS-HDPRO: where femtosecond precision meets ultra-compact design.
Engineered for the most demanding micromachining applications, it brings together nanometric accuracy, real-time vision, and powerful laser control — all in a footprint that fits on your lab bench. Think big. Machine small.
LS-HDPRO
ULTRA COMPACT ALL-IN-ONE LASER MICROMACHINING SYSTEM
LS-HDPRO is an ultra-compact, all-in-one laser micromachining workstation designed for high-precision applications using nanosecond or femtosecond lasers across IR, green, and UV wavelengths. It integrates a 20-bit 2D galvanometric scanner, co-linear vision with autofocus, and advanced multi-axis control for high-resolution positioning, including rotation and tilt. With nanometer-scale resolution and laser spot sizes down to 1 µm, LS-HDPRO delivers exceptional accuracy in a minimal footprint. Its Class 1 laser-safe enclosure, CAD-based interface, and optional integrated 3D metrology make it the ideal solution for both production and research environments.
Typical Specifications
| Motors Travel Range (XYZ) | Up to 100 mm x 100 mm x 13 mm |
| Resolution | Down to 20 nm (XY), 0.1 μm (Z) |
| Repeatability | ± 0.3 μm (XY); ± 0.1 μm (Z) |
| Accuracy | ± 2.5 μm (XY); ± 1 μm (Z) |
| Available Laser Sources | Green-UV ns or IR fs laser |
| Substrate Holder | Custom |
| Minimum Laser Spot Size | Down to 1 μm |
| External Dimensions | 600 x 745 x 820 mm (W x D x H) |
| Weight | Aprox. 120 Kg |
| Control Unit | Integrated PC with dual 27″ monitor |
Features
Fixed optical head with motorized objective changer and multiple telecentric lenses
Co-linear vision system with autofocus and motorized beam optics
Co-linear laser metrology with closed-loop correction and optional 2D scan
Automated camera calibration.
Automatic feature recognition for alignment and rotation correction
CAD-based interface with DXF, DWG, ACIS support
Class 1 laser-safe enclosure with automatic door and optional anti-vibration platform
Applications
Solar Cell Processing
Wafer scribing and dicing
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